Title:
PROCESS LIQUID-SUPPLYING NOZZLE, SUBSTRATE-PROCESSING APPARATUS, AND SUBSTRATE-PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2014236119
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a process liquid-supplying nozzle, a substrate-processing apparatus and a substrate-processing method which can prevent a substrate from being damaged while taking advantage of the property of bubbles included in a cleaning solvent to effectively perform a process.SOLUTION: A substrate-processing apparatus for processing a substrate W by use of a process liquid L comprises: a process liquid-producing part 4 for producing the process liquid L including fine bubbles; and a process liquid-supplying nozzle 3 for supplying the process liquid produced by the process liquid-producing part to the substrate. The process liquid-supplying nozzle has: a tank capable of storing the process liquid including fine bubbles; a first divider 30a dividing the tank into two areas; a pipe P1 for taking the process liquid into one of the areas of the tank; an outlet 3a for discharging the process liquid from the other area of the tank; and an ultrasonic-wave oscillator 31 on an outer side wall of the one area of the tank.
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Inventors:
HAYASHI KONOSUKE
MIYAZAKI KUNIHIRO
MIYAZAKI KUNIHIRO
Application Number:
JP2013116927A
Publication Date:
December 15, 2014
Filing Date:
June 03, 2013
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
H01L21/304; B05D1/26; B05D3/10; B05D3/12; B08B3/08; B08B3/12
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