Title:
PROCESS FOR MANUFACTURING PIEZOELECTRIC DEVICE
Document Type and Number:
Japanese Patent JP2007281598
Kind Code:
A
Abstract:
To provide a process for manufacturing a piezoelectric device in which a piezoelectric vibration chip can be separated with good profile, product quality can be improved by enhancing mount precision, and manufacturing cost can be reduced.
The process for manufacturing a piezoelectric device comprises a step for forming a fragile layer at the joint 4 of a frame 2 and an element piece 40-1 by irradiating the joint 4 with femtosecond laser, and a step for dividing the frame 2 and the element piece 40-1 at the joint 4.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
ISHII OSAMU
Application Number:
JP2006102097A
Publication Date:
October 25, 2007
Filing Date:
April 03, 2006
Export Citation:
Assignee:
EPSON TOYOCOM CORP
International Classes:
H03H3/02; H01L41/09; H01L41/18; H01L41/22; H01L41/23; H01L41/338; H03H9/10
Attorney, Agent or Firm:
岡▲崎▼ 信太郎
Arai Zen
Masayuki Kanita
Arai Zen
Masayuki Kanita