Title:
PROCESS FOR REFLOW SOLDERING
Document Type and Number:
Japanese Patent JPH038596
Kind Code:
A
Abstract:
PURPOSE: To minimize the residue after soldering by reflow soldering by solder contg. non-rosin-based flux in a specific atmosphere.
CONSTITUTION: The solder contg. the non-rosin-based flux is heated in a low- oxidizing atmosphere of the main gas selected from a group consisting of (a) about ≤1500 ppm oxygen, (b) about ≤1.5 vol.% steam and (c) nitrogen, carbon dioxide, hydrogen, inert gas or their mixture, by which the execution of the reflow soldering to minimize the residue after soldering is made possible.
Inventors:
NIKIRESU BANDEIOPADEIYAI
MAAKU JIEI KAASHIYUNAA
MAAKU JIEI KAASHIYUNAA
Application Number:
JP6952890A
Publication Date:
January 16, 1991
Filing Date:
March 19, 1990
Export Citation:
Assignee:
BOC GROUP INC
International Classes:
B23K31/02; B23K1/19; B23K35/22; B23K35/363; B23K35/38; H05K3/34; B23K101/42; (IPC1-7): B23K31/02; B23K35/22; B23K35/363; B23K101/42; H05K3/34
Domestic Patent References:
| JPS63104777A | 1988-05-10 | |||
| JPS5417350A | 1979-02-08 |
Attorney, Agent or Firm:
Kyozo Yuasa (4 outside)
Next Patent: JPH038597