Title:
加工粉回収装置
Document Type and Number:
Japanese Patent JP7464416
Kind Code:
B2
Abstract:
A waste liquid treating device includes a holding section that holds an adhesion plate, a vertically moving mechanism that moves the holding section vertically, and a peeling mechanism that peels off water-containing swarf from the adhesion plate held by the holding section. The peeling mechanism includes two air nozzles extending in parallel to each other in a horizontal direction with a spacing therebetween and including jet ports formed to face each other, a valve disposed in a piping providing communication between the two air nozzles and an air source, and a control unit that performs control of opening and closing of the valve and control of the vertically moving mechanism for moving the adhesion plate in the vertical direction in the spacing between the two air nozzles.
Inventors:
Satoshi Sugiyama
Application Number:
JP2020046296A
Publication Date:
April 09, 2024
Filing Date:
March 17, 2020
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B57/02; B01D57/02; B03C5/00; B03C5/02; B23Q11/00; B23Q11/10
Domestic Patent References:
| JP2009056553A | ||||
| JP2016049506A | ||||
| JP2014124576A | ||||
| JP2004122314A | ||||
| JP2000189834A | ||||
| JP4059001A | ||||
| JP7326350A | ||||
| JP2002333271A | ||||
| JP9141133A | ||||
| JP5277595A | ||||
| JP4128142U |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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