Title:
MANUFACTURING METHOD OF WORKPIECE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING DEVICE FOR WORKPIECE
Document Type and Number:
Japanese Patent JP2023144386
Kind Code:
A
Abstract:
To provide a manufacturing method of a workpiece capable of obtaining higher connection reliability when manufacturing the workpiece using a processing target object in which a groove is previously formed along a position where the processing target object should be cut.SOLUTION: A manufacturing method of a workpiece includes: a preparation step of preparing a processing target object 1 including at least a lead frame where a groove 5 is previously formed along a position where the processing target object should be cut; a surface layer removal step of partially removing a surface layer portion 3c, where the groove 5 is formed, in the processing target object 1 before cutting the processing target object 1; and a plating step of applying plating processing to the processing target object 1, from which the surface layer portion 3c is partially removed, before cutting the processing target object 1. In a state before implementing the surface layer removal step, the surface layer portion 3c includes a cut region 3m, which is removed by cutting the processing target object 1, and a non-cut region 3n positioned between the cut region 3m and an opening end 5 of the groove 5. In the surface layer removal step, at least a part of the non-cut region 3n is removed.SELECTED DRAWING: Figure 10
Inventors:
HANASAKA SHUHO
FUJIWARA NAOMI
TAKAMORI TAKEHIRO
NAKAMURA KEIICHI
ISHIBASHI KANJI
FUJIWARA NAOMI
TAKAMORI TAKEHIRO
NAKAMURA KEIICHI
ISHIBASHI KANJI
Application Number:
JP2022051327A
Publication Date:
October 11, 2023
Filing Date:
March 28, 2022
Export Citation:
Assignee:
TOWA CORP
International Classes:
H01L23/50
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office