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Patent Searching and Data


Title:
PROCESSED WOODY MATERIAL
Document Type and Number:
Japanese Patent JP2001353704
Kind Code:
A
Abstract:

To provide a processed woody material such as a woody board, compacted wood, a woody laminate and the like which is free from emission of formaldehyde and excellent in heat resistance and dimensional stability for humidity variation.

The processed woody material contains a hardened material of a resin composition comprising maleimide compound and methallyl phenol compound or methallyl phenyl ether compound.


Inventors:
WASHIMI AKIRA
TAKEI MASAO
HIRAOKA HIDEKI
KIMURA KAORU
Application Number:
JP2000176144A
Publication Date:
December 25, 2001
Filing Date:
June 12, 2000
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
B27K3/50; B27N3/02; C08F2/44; C08F212/14; C08F216/16; C08F222/40; C08F251/02; C08J5/04; (IPC1-7): B27K3/50; B27N3/02; C08F2/44; C08F212/14; C08F216/16; C08F222/40; C08F251/02; C08J5/04