Title:
PROCESSING DEVICE AND MANUFACTURING METHOD OF PROCESSED PRODUCT
Document Type and Number:
Japanese Patent JP2022148886
Kind Code:
A
Abstract:
To reduce the footprint of a processing device.SOLUTION: A processing device includes a substrate housing portion 111 housing a sealed substrate W, cutting tables 2A and 2B on which the sealed substrate W is processed by a cutting mechanism 4, a receiving stage 115 that receives the sealed substrate W from the substrate housing portion 111, a stage moving mechanism 117 having a moving rail 117a for moving the receiving stage 115 to the transport position, a first holding mechanism 3 that holds the sealed substrate W to transfer the substrate to the cutting tables 2A and 2B, and a transport moving mechanism 7 having a transfer shaft 71 for moving the first holding mechanism 3 between the receiving stage 115 at the transport position and the cutting tables 2A and 2B, and the transfer shaft 71 and the moving rail 117a are orthogonal to each other in plan view.SELECTED DRAWING: Figure 10
Inventors:
FUKAI MOTOKI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
YOSHIOKA SHO
KATAOKA SHOICHI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
YOSHIOKA SHO
KATAOKA SHOICHI
Application Number:
JP2021050737A
Publication Date:
October 06, 2022
Filing Date:
March 24, 2021
Export Citation:
Assignee:
TOWA CORP
International Classes:
H01L21/301; B23Q7/04; B24B27/06; B24B41/06; B24B45/00; H01L21/677
Attorney, Agent or Firm:
Nishimura Ryuhei
Shindai Saito
Yoshinaga Uemura
Nakamura Atsushi
Haruko Maeda
Shindai Saito
Yoshinaga Uemura
Nakamura Atsushi
Haruko Maeda