Title:
PROCESSING DEVICE AND METHOD FOR MANUFACTURING PROCESSED PRODUCT
Document Type and Number:
Japanese Patent JP2023010304
Kind Code:
A
Abstract:
To simplify a device configuration, reduce footprint, and reduce a size of a storage space for segmentalized workpieces.SOLUTION: A processing apparatus includes processing tables 2A and 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate W in order to transport the sealed substrate W to the processing tables 2A and 2B, a processing mechanism 4 for cutting and segmentalized the sealed substrate W held on the processing tables 2A and 2B, a storage box 5 in which the sealed substrates W segmentalized by the processing mechanism 4 are dropped and stored, a second holding mechanism 6 for holding a product P in order to transport the product P from the processing tables 2A, 2B to the storage box 5, a transfer movement mechanism 7 which extends along an arrangement direction of the processing tables 2A, 2B and a collection box 5 and has a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a processing movement mechanism 8 for moving the processing mechanism 4 in each of a first direction along the transfer shaft 71 and a second direction orthogonal to the first direction on a horizontal plane.SELECTED DRAWING: Figure 1
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Inventors:
FUKAI MOTOKI
KATAOKA SHOICHI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
KATAOKA SHOICHI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
Application Number:
JP2021114351A
Publication Date:
January 20, 2023
Filing Date:
July 09, 2021
Export Citation:
Assignee:
TOWA CORP
International Classes:
H01L21/301; B24B27/06; B24B55/06; B26D7/18
Attorney, Agent or Firm:
Nishimura Ryuhei
Shindai Saito
Nakamura Atsushi
Haruko Maeda
Shindai Saito
Nakamura Atsushi
Haruko Maeda