PROCESSING DEVICE AND METHOD FOR MANUFACTURING PROCESSED PRODUCT

Japanese Patent JP2023013000

A

To stick a segmented object to an adhesive surface without requiring a moving mechanism for moving a processing table.SOLUTION: A cutting apparatus 100 includes cutting tables 2A and 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate, a cutting mechanism 4 for cutting and segmentalizing the sealed substrate W into individual pieces, a transfer table 5 onto which the segmentalized products are transferred, a second holding mechanism 6 for holding a plurality of products, a transport movement mechanism 7 which extends along an arrangement direction of the cutting tables and the transfer table and has a common transfer shaft 71 for moving the first holding mechanism and the second holding mechanism, a processing movement mechanism 8 for moving the cutting mechanism in an X direction along a transfer shaft and a Y direction orthogonal to the X direction on a horizontal plane, a mounting table 21 on which a sticking member 20 having an adhesive surface to which a plurality of products is stuck is mounted, and a sticking transport mechanism 22 for transporting a plurality of products P from the transfer table 5 to the sticking member 20 mounted on the mounting table.SELECTED DRAWING: Figure 1

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FUKAI MOTOKI
KATAOKA SHOICHI
IMAI ICHIRO

JP2021116850A

January 26, 2023

July 15, 2021

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TOWA CORP

H01L21/301; B23Q7/04; B23Q41/06

Nishimura Ryuhei
Shindai Saito
Nakamura Atsushi
Haruko Maeda

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