Title:
PROCESSING DEVICE, AND PRODUCTION METHOD OF PROCESSED PRODUCT
Document Type and Number:
Japanese Patent JP2022148902
Kind Code:
A
Abstract:
To facilitate a device configuration of a processing device having a blade exchange mechanism and reduce footprint.SOLUTION: A processing device comprises: cutting tables 2A, 2B on which a sealed substrate W is processed by a cutting mechanism 4; a cutting movement mechanism 8 for moving the cutting mechanism 4 in first and second directions which are orthogonal each other in a horizontal plane; and a blade exchange mechanism 24 for exchanging blades 41A, 41B of the cutting mechanism 4. The cutting movement mechanism 8 has; a pair of first guide rails 811 which is provided along the first direction in a state of sandwiching the cutting tables 2A, 2B; and a support body 812 which moves along the pair of first guide rails 811, and supports the cutting mechanism 4 movably along the second direction. The blade exchange mechanism 24 has: a first adsorption part 241a adsorbing the blades 41A, 41B; and an arm moving mechanism 242 for moving the first adsorption part 241a in the second direction.SELECTED DRAWING: Figure 10
Inventors:
FUKAI MOTOKI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
YOSHIOKA SHO
KATAOKA SHOICHI
HORI SATOKO
SAKAUE YUYA
YAMAMOTO YUKO
YOSHIOKA SHO
KATAOKA SHOICHI
Application Number:
JP2021050755A
Publication Date:
October 06, 2022
Filing Date:
March 24, 2021
Export Citation:
Assignee:
TOWA CORP
International Classes:
B24B45/00; B23Q3/155; B24B27/06; B24B41/06; B24B53/00; B24B53/12; H01L21/301; H01L21/677
Attorney, Agent or Firm:
Nishimura Ryuhei
Shindai Saito
Yoshinaga Uemura
Nakamura Atsushi
Haruko Maeda
Shindai Saito
Yoshinaga Uemura
Nakamura Atsushi
Haruko Maeda