Title:
加工装置及び加工方法
Document Type and Number:
Japanese Patent JP7038822
Kind Code:
B2
Abstract:
This machining device for machining a substrate includes: a plurality of rotary holding units for holding and rotating a substrate; a plurality of conveyance units for conveying the substrate; a plurality of processing units for consecutively processing the substrate; and a control unit for respectively grouping and controlling the plurality of rotary holding units, the plurality of conveyance units, and the plurality of processing units. The control unit: respectively manages states of the rotary holding units, states of the conveyance units, and states of the processing units; controls holding of the substrate at the plurality of rotary holding units in accordance with the states of the rotary holding units; controls conveyance of the substrate at the plurality of conveyance units in accordance with the states of the conveyance units; and controls processing of the substrate at the plurality of processing units in accordance with the states of the processing units.
Inventors:
Tomohiro Kaneko
Keitaka Hara
Keitaka Hara
Application Number:
JP2020527360A
Publication Date:
March 18, 2022
Filing Date:
June 10, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B7/00; H01L21/304; B24B7/04; B24B41/06; B24B55/02; H01L21/677
Domestic Patent References:
| JP5473736B2 | ||||
| JP2013254964A | ||||
| JP2015065478A | ||||
| JP2012199328A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine