Title:
加工装置及び加工方法
Document Type and Number:
Japanese Patent JP7465986
Kind Code:
B2
Abstract:
This processing device for processing a substrate comprises: a polishing mechanism which is provided with an annular grindstone for processing a substrate held by a holding mechanism; a polishing solution supply mechanism which supplies a polishing solution to the processing surface of the substrate; and an adjustment solution supply mechanism which supplies an adjustment solution for cooling an arbitrary position on the processing surface of the substrate.
Inventors:
Munehisa Kodama
Application Number:
JP2022547517A
Publication Date:
April 11, 2024
Filing Date:
August 31, 2021
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B55/02; B24B7/04; B24B45/00; B24B49/03; H01L21/304
Domestic Patent References:
| JP2020093338A | ||||
| JP2017164823A | ||||
| JP2014103215A | ||||
| JP2004200526A | ||||
| JP11333719A | ||||
| JP5309566A | ||||
| JP2019214109A | ||||
| JP2020093381A |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine