Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
加工装置
Document Type and Number:
Japanese Patent JP7039029
Kind Code:
B2
Abstract:
To provide a processing device whose size and weight may be reduced and which has an excellent practicality.SOLUTION: It comprises: a base 21, a mounting flange which is provided on the base 21 for attachment onto a robot arm, a grinding wheel 12 removably mounted on a rotating shaft 30, driving means mounted on the rotating shaft 30 for rotational drive of the grinding wheel 12, a spline part 41 and a spline bearing 15 for restricting the grinding wheel 12 mounted on the rotating shaft 30 from moving in the circumferential direction, a collar 37 and a sleeve 48 for restricting the grinding wheel 12 mounted on the rotating shaft 30 from moving to the rotating shaft 30 in the axial direction, a retaining release mechanism for enabling the grinding wheel 12 to be detached from the rotating shaft 30, a lock mechanism for disabling the operation of the retaining release mechanism, and a lock cancel mechanism that disables the operation of the lock mechanism.SELECTED DRAWING: Figure 5

Inventors:
Hitoshi Shinnaya
Masao Funaya
Application Number:
JP2018109937A
Publication Date:
March 22, 2022
Filing Date:
June 08, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Shinryo Techno Service Co., Ltd.
International Classes:
B23B31/00; B24B45/00; B23B31/02; B23Q3/12; B23Q3/155; B25J15/04
Domestic Patent References:
JP60217038A
JP4164565A
JP6114727A
JP54052781U
JP7096408A
Foreign References:
US4520550
Attorney, Agent or Firm:
Hiroshi Tokuin