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Title:
PROCESSING METHOD AND PEELING METHOD OF PROCESSING LAYER, AND COMPOSITION FOR TEMPORAL FIXATION
Document Type and Number:
Japanese Patent JP2012052031
Kind Code:
A
Abstract:

To provide a processing method of a processing layer, in which the peelability of the processing layer is good and the residue of an adhesive layer is less in a method of temporarily fixing and processing the processing layer.

The processing method of the processing layer includes, in this order, (1) a process for forming, on a substrate 10, the adhesive layer 20 that contains a polymer (A) and a photoradical generator (B) in which the content of a polymerizable compound is 10 wt.% or less out of 100 wt.% of the adhesive layer, (2) a process for forming the processing layer 30 on the adhesive layer 20, (3) a process for processing the processing layer 30, (4) a process for irradiating light 40 to the adhesive layer 20 from the substrate 10 side, and (5) a process for peeling the processing layer 30 after processing from the substrate 10.


Inventors:
TAKAHASHI SEIICHIRO
MIYAMATSU TAKASHI
GOTO HIROFUMI
Application Number:
JP2010195997A
Publication Date:
March 15, 2012
Filing Date:
September 01, 2010
Export Citation:
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Assignee:
JSR CORP
International Classes:
C09J5/00; C09J11/06; C09J201/00
Attorney, Agent or Firm:
Patent corporation ssinpat