To obtain a work procedure for efficiently recovering a piezoelectric element plate of a wafer state from a polishing device, after polishing the thickness or processing a surface mirror surface, by using the polishing device.

For solving the problem, this invention is a processing method of the piezoelectric element plate for recovering the piezoelectric element plate from a surface polishing device after polishing the thickness of the piezoelectric element plate or processing the surface mirror surface, and solves the problem by consistently processing a process of recovering the piezoelectric element plate to an exclusive tray, a process of cleaning in a cleaning process by storing the exclusive tray in a cleaning frame for collectively storing a plurality and a process of drying in a drying process after cleaning processing, after polishing the thickness or processing the surface mirror surface.