Title:
透光性硬質基板積層体の加工方法及びこれを使用した板状製品の製造方法
Document Type and Number:
Japanese Patent JP5831887
Kind Code:
B2
Abstract:
Provided is a method of processing a translucent rigid substrate laminate, whereby it becomes possible to maintain peeling properties and good appearance of the translucent rigid substrate laminate during the processing of the translucent rigid substrate laminate even when a process such as transportation and storage is included in the method. The method of processing a translucent rigid substrate laminate comprises a step 1 for producing a translucent rigid substrate laminate in which at least two translucent rigid substrates are bonded to each other with a photocurable adhering agent; a step 2 for maintaining the translucent rigid substrate laminate, which has been produced in step 1 or which has been subjected to a shape processing subsequent to step 1, under predetermined temperature management conditions and transporting and/or storing the translucent rigid substrate laminate while maintaining the translucent rigid substrate laminate under the above-mentioned conditions; and a step 3 for peeling the translucent rigid substrate laminate which has been subjected to the shape processing or has not been subjected to the shape processing subsequent to step 2.
Inventors:
Hiroyuki Kurimura
Miyazaki Hayato
Miyazaki Hayato
Application Number:
JP2012546835A
Publication Date:
December 09, 2015
Filing Date:
November 25, 2011
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
B32B37/06; B32B17/10; C03C27/10; C08F2/48; C08F290/06
Domestic Patent References:
| JP201018505A | ||||
| JP1171553A | ||||
| JP2000169166A | ||||
| JP2004186201A | ||||
| JP2001226641A | ||||
| JP2006341564A | ||||
| JP2002256226A | ||||
| JP2007119646A |
Foreign References:
| WO2010010900A1 | ||||
| WO2007049566A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation