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Title:
集束イオンビームを用いた加工方法、ナノチューブプローブ、顕微鏡装置、及び電子銃
Document Type and Number:
Japanese Patent JP4523302
Kind Code:
B2
Abstract:

To achieve highly precise and uniform fine processing by adjusting focused ion beam irradiation energy or a processing speed per processing area unit when a sample having a gradient of a processing depth and/or a processing efficiency is processed by irradiating a focused ion beam.

The processing method using the ion beam sets an area having a largest average processing depth as an initial processing area, when a processing area has the gradient of the processing depth or processing efficiency; and sets more than one stage of an continuously or stepwise expanded processing area in a direction in which the average processing depth of the initial processing area becomes shallow or in a direction in which the processing efficiency becomes large, after processing the initial processing area; and successively processes the expanded processing area in the direction in which the averaged processing depth becomes shallow, and removes the entire of the processing area. Accordingly, the method can set the beam irradiation energy or the processing speed per processing area unit and achieve the highly precise and uniform fine processing.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Yamanaka Shigenori
Ryuho Okawa
Akio Harada
Application Number:
JP2004064884A
Publication Date:
August 11, 2010
Filing Date:
March 08, 2004
Export Citation:
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Assignee:
Daiken Chemical Industry Co., Ltd.
International Classes:
H01J37/317; G01Q60/16; G01Q60/38; G01Q70/00; G01Q70/12; G01Q70/16
Domestic Patent References:
JP11250851A
JP2003149185A
JP2002162335A
JP2003337099A
JP2000081381A
JP2000249712A
JP2001261316A
Attorney, Agent or Firm:
Hisami Miki



 
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