Title:
被加工物の加工方法
Document Type and Number:
Japanese Patent JP7081993
Kind Code:
B2
Abstract:
An object of the invention is to provide a processing method in which a modified layer inside a workpiece is used as a starting point to divide the workpiece without causing grinding debris to be attached to a side surface of a chip. To achieve the object, there is provided a processing method of a workpiece, which includes: a step of irradiating a workpiece (W) with a transmissive laser beam (LB1) from a back surface (Wb) side along a predetermined dividing line (S), and forming a first modified layer (M1) having a lower end disposed to be further slightly close to the back surface (Wb) side in comparison with a height position (Z1) corresponding to a finished thickness of a chip without generating cracks vertically; a step of irradiating the workpiece (W) with a transmissive laser beam (LB2) from the back surface (Wb) side along the predetermined dividing line (S), and forming a second modified layer (M2) disposed to be further close to the back surface (Wb) side in comparison with the first modified layer (M1) for generating cracks (Mb, Ma) vertically; and a step of grinding the back surface (Wb) of the workpiece (W) to form the finished thickness (H1) of the chip, and using the second modified layer (M2) as a starting point to divide the workpiece (W) into chips (C).
Inventors:
Yuya Matsuoka
Application Number:
JP2018115976A
Publication Date:
June 07, 2022
Filing Date:
June 19, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/53; B24B7/04; H01L21/304
Domestic Patent References:
| JP2013105822A | ||||
| JP2018160623A | ||||
| JP2013214601A | ||||
| JP2017147289A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
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