Title:
Processing method
Document Type and Number:
Japanese Patent JP6214192
Kind Code:
B2
Abstract:
A method of processing a plate-shaped workpiece includes: a positioning step of mounting the plate-shaped workpiece on a support plate; a joining step of irradiating an outer peripheral portion of the plate-shaped workpiece mounted on the support plate with a laser beam to form a fusion bond region where the plate-shaped workpiece is fusion-bonded to the support plate at the outer peripheral portion of the plate-shaped workpiece, thereby fixing the plate-shaped workpiece onto the support plate; and a processing step of processing the plate-shaped workpiece after the joining step.
Inventors:
Frank Way
Application Number:
JP2013082708A
Publication Date:
October 18, 2017
Filing Date:
April 11, 2013
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2013026614A | ||||
| JP2005338281A | ||||
| JP2007279222A | ||||
| JP2005216887A |
Attorney, Agent or Firm:
Akira Matsumoto