Title:
PROCESSING QUALITY PREDICTION SYSTEM
Document Type and Number:
Japanese Patent JP2021074842
Kind Code:
A
Abstract:
To provide a processing quality prediction system that can predict a depth of an affected layer generated in a work-piece, with higher accuracy.SOLUTION: A processing quality prediction system 1 comprises: a grinder main body 11 that performs grinding processing to a work-piece W with a grinding wheel T; a detector 13d that detects observable state data in the grinder main body 11 during grinding processing of the work-piece W; and a prediction part 73 that predicts a depth of an affected layer generated in the work-piece W on the basis of the state data detected by the detector 13d. The detector 13d includes a heat flow sensor that detects as the state data heat radiation data obtained from a position different from a grinding point Pa on a surface of at least either of the grinding wheel T and the work-piece W.SELECTED DRAWING: Figure 4
Inventors:
SHIBATA HIROYUKI
MORITA HIROSHI
YONEZU HISAHIRO
ISHIGURE YUKI
SAEKI YUYA
MORITA HIROSHI
YONEZU HISAHIRO
ISHIGURE YUKI
SAEKI YUYA
Application Number:
JP2019204673A
Publication Date:
May 20, 2021
Filing Date:
November 12, 2019
Export Citation:
Assignee:
JTEKT CORP
International Classes:
B24B49/14; B24B5/00; B24B49/10; B24B49/16; B24B53/04; B24B55/02
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
Patent business corporation Kyoritsu
Patent business corporation Kyoritsu