Title:
PRODUCTION OF BUSHING BASE PLATE
Document Type and Number:
Japanese Patent JP3186557
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To produce a bushing base plate having stable bonding strength, suitable shape meeting the spinning condition and prolonged life by inserting a hollow pipe into a through-hole formed on a bushing base plate substrate, expanding the hollow pipe from inside and bonding the pipe to the substrate by thermal diffusion.
SOLUTION: A circular or non-circular through-hole 3 is opened on a bushing base plate substrate 1. A hallow pipe 2 having an outer diameter equal to or smaller than the inner diameter of the through-hole 3 and an outer contour similar to the shape of the through-hole 3 is inserted into the through-hole and fixed to the hole by radially expanding the hollow pipe 2 from inside. The assembly is heated at a temperature higher than 500°C and lower than the melting point of the material by 20°C to effect the thermal diffusion and bond the hollow pipe 2 to the bushing base plate substrate 1.
Inventors:
Susumu Shimizu
Makoto Mitani
Toshio Homma
Katsumi Suguro
Makoto Mitani
Toshio Homma
Katsumi Suguro
Application Number:
JP32755195A
Publication Date:
July 11, 2001
Filing Date:
December 15, 1995
Export Citation:
Assignee:
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
B23K20/00; B23P11/02; C03B37/083; (IPC1-7): C03B37/083; B23K20/00; B23P11/02
Domestic Patent References:
| JP5254875A | ||||
| JP781968A | ||||
| JP54162653A | ||||
| JP61216821A | ||||
| JP61159233A | ||||
| JP691336A |