PURPOSE: To suppress the generation of warpage and crack by packing an org. high polymer of a UV curing type into the grooves formed like a grating exclusive of a part thereof in the piezoelectric 1 and curing the high polymer.
CONSTITUTION: The grooves 2 are formed like the grating (network) in the piezoelectric 1 to form two-dimensionally arranged columnar parts 3 and a planar surface 4 is made to remain after cutting on the other surface. The grooves 2 are so formed that the depth of the grooves, i.e. the height of the columnar parts 3 of the piezoelectric 1 finally attains the thickness desired as the composite piezoelectric 1. A UV curing type resin 5 is then packed as the org. high polymer to be cured by UV rays in the grooves 2 of the piezoelectric 1 and is irradiated with UV rays, by which the resin is cured with a low shrinkage rate and at room temp. The shrinkage rate is slight in such a manner, the generation of the warpage and crack by the shrinkage is obviated and the resin is cured in a flat state. The accuracy at the time of polishing is thus improved.
SAITO TAKAYOSHI
SHINODA FUMIKA
