PURPOSE: To improve the cooling efficiency of a cooling block for semiconductor elements for cooling the semiconductor elements by passing a cooling medium in circulation paths disposed within the cooling block consisting of metal.
CONSTITUTION: This cooling block 10 for the semiconductor elements for cooling the semiconductor elements by passing the cooling medium in the circulation paths disposed within the cooling block consisting of the metal consists of cooling pipes 1 which are made of metal and are mounted within the circulation paths and spiral structural bodies 2 which are formed by twisting metallic tapes mounted within these cooling pipes. The cooling block 10 for the semiconductor elements is formed by joining the end edges of these spiral structural bodies 2 to the inside surfaces of the cooling pipes 1.
SHIBUYA SUMIICHI
NISHI TADASHI
