To obtain a method for producing a copper alloy for electronic equipment, excellent in characteristics, such as strength, electric conductivity, bendability, stress relaxation property, and thermal peeling resistance of solder.

A copper alloy material, which has a composition consisting of, by weight, 0.05-0.4% Cr, 0.03-0.25% Zr, 0.05-2.0% Zn, and the balance Cu with inevitable impurities and further containing, if necessary, (1) 0.1-1.8% Fe and 0.1-0.8% Ti or (and) (2) 0.01-1.0%, in total, of one or more elements among Ni, Sn, In, Mn, P, Mg, and Si, is used. This material is subjected, in succession, to (a) solution heat treatment at ≥700°C for regulating crystalline grain size to ≤40μm, to (b) cold rolling at 20-60% draft, to (c) aging treatment at 300-700°C, to (d) cold rolling at ≤30% draft, and then to (e) stress relief annealing at 350-700°C.