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Patent Searching and Data


Title:
PRODUCTION OF COPPER-CLAD LAMINATED PLATE
Document Type and Number:
Japanese Patent JPS5598231
Kind Code:
A
Abstract:

PURPOSE: To provide a copper clad laminated plate having excellent electrical characteristics, chemical resistance, water resistance, and mechanical properties by lamination molding of copper foil with pre-preg consisting of glass cloth impregnated with polybutadiene-modified resol and dried.

CONSTITUTION: A phenolic compound is added to polybutadiene having at least 80% of 1, 4-structure and a number-average MW of 150W10,000 in the presence of acidic catalyst and reacted to form a composition consisting of adduct and phenols. This composition is reacted with formaldehyde to produce polybutadiene-modified resol. This resol is impregnated into glass cloth and dried to form pre-preg. A given number of the pre-pregs are layer with a copper foil, and both are laminated and molded. If polybutadiene used has a number-average MW less than 150, laminated plate has low resistance to chemicals and heat. If MW exceeds 10,000, impregnation into laminate substrate becomes poor and therefore is not preferable.


Inventors:
SAGOU SHIYOUICHI
NOGUCHI MASANOBU
MATSUDA YOSHINOBU
YASUI MASAAKI
Application Number:
JP642379A
Publication Date:
July 26, 1980
Filing Date:
January 22, 1979
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B32B15/04; B32B15/08; C08J5/24; (IPC1-7): B32B15/08; C08J5/24