Title:
PRODUCTION OF FE-NI BASE ELECTRONIC MATERIAL THIN SHEET EXCELLENT IN SHRINKAGE RESISTANCE
Document Type and Number:
Japanese Patent JP2614395
Kind Code:
B2
Abstract:
PURPOSE: To establish new producing technology for an Fe-Ni base electronic material thin sheet excellent in shrinkage resistance and the properties of shape and hardness.
CONSTITUTION: An electronic material thin sheet having a compsn. contg., by weight, 0.001 to 0.03% C, ≤0.01% N, 0.01 to 2.0% Si, 0.01 to 3.0% Mn, 30 to 50% Ni, 0.01 to 1.0% Cr and ≤0.01% S or furthermore contg. 0.0005 to 0.02% B and/or ≤2.0% Nb, ≤0.4% Zr, ≤4.0% Co, ≤4.0% Cu, ≤1.0% Ti, ≤1.0% Al and ≤0.5% Be is subjected to recrystallization annealing at 720 to 950°C and is subjected to cold rolling at ≥20% draft to regulate its sheet thickness into ≤0.3mm. After that, tension annealing is executed under the conditions of 0.3 to 8.0kgf/mm2 tension, 650 to 800°C and ≥10sec.
Inventors:
Wang Kun
Toshihiko Taniuchi
Saito Fujiwara
Toshihiko Taniuchi
Saito Fujiwara
Application Number:
JP6196893A
Publication Date:
May 28, 1997
Filing Date:
March 22, 1993
Export Citation:
Assignee:
Nippon Yakin Kogyo Co., Ltd.
International Classes:
C21D8/02; C22C38/00; H01L23/48; (IPC1-7): C21D8/02; C22C38/00; H01L23/48
Domestic Patent References:
| JP60251227A | ||||
| JP62290828A |
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)
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