PURPOSE: To obtain the titled laminate of pure polyimide type free from modification with another resin, by blending an addition product of an N,N'-bisimide compound of an unsaturated dicarboxylic acid shown by a specific formula and an aminophenol shown by a specific formula in a fixed ratio with a curing promotor.

CONSTITUTION: (A) An addition product obtained by reacting (i) an N,N'- bisimide compound of an unsaturated dicarboxylic acid shown by formula I (R1 is bifunctional group containing at least two carbons; R2 is bifunctional group containing C=C) with (ii) an aminophenol shown by formula II (R3 is H, halogen or alkyl) in a molar ratio (component ii/i) of 0.1W1 is blended with (B) a curing promotor to give a heat-resistant resin. The resin is piled on a bonded substrate and molded under heating and pressure to give the aimed laminate.

EFFECT: Having improved solubility and low-temperature molding properties and improved bond strength to copper foil and interlaminar strength to glass cloth.