PRODUCTION OF INORGANIC SUBSTRATE WITH LAMINATED COPPER FILM

Title:

PRODUCTION OF INORGANIC SUBSTRATE WITH LAMINATED COPPER FILM

Document Type and Number:

Japanese Patent JPH03264660

Kind Code:

A

Abstract:

PURPOSE: To tightly stick a copper film having a smooth surface on an inorg. substrate by successively laminating a thin copper film having high adhesive strength and a copper film having a smooth surface on the substrate under specified conditions in an atmosphere obtd. by introducing rare gas as gas for electric discharge into a high vacuum.

CONSTITUTION: A thin copper film of 0.2-2μm thickness is formed by vapor plating on an inorg. substrate of ceramics, etc., heated to 800-1050°C surface temp. in an atmosphere obtd. by introducing rare gas such as Ar as gas for electric discharge into a high vacuum of about 5×10-4 pa. Since copper particles enter the fine recesses in the surface of the substrate, the copper film bonds tightly to the substrate. The surface temp. of the substrate is then reduced to 140-400°C and a copper film of 1-30μm thickness is formed by vapor plating. A copper film having high adhesive strength to the substrate and a smooth surface can be formed.

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Inventors:

NAKAMOTO TOKUHIRO
NOBETANI TORU
TONE KAORU

Application Number:

JP6500290A

Publication Date:

November 25, 1991

Filing Date:

March 15, 1990

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD

International Classes:

C23C14/14; H01L23/12; H05K3/00; (IPC1-7): C23C14/14; H01L23/12; H05K3/00

Attorney, Agent or Firm:

Ishida Chochichi (2 outside)

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