Title:
PRODUCTION OF METAL FOIL CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JP3125582
Kind Code:
B2
Abstract:
PURPOSE: To reduce the elasticity of the layer under metal foil in order to ensure solder connection reliability as a metal foil clad laminated sheet for an SMD corresponding printed wiring board while ensuring heat resistance and the peel strength of metal foil and to solve even a problem from the aspect of productivity caused by blocking.
CONSTITUTION: In the molding of a metal foil clad laminated sheet, a prepreg whose upper surface is coated with a low elasticity resin (e.g. a compd. of acrylonitrile/butadiene rubber, an alkylphenol resin, an epoxy resin and an inorg. filler) is arranged under metal foil. The adhesion amt. of the low elasticity resin (containing an inorg. filler) of the prepreg is pref. 5-20wt.%.
Inventors:
Minoru Midogochi
Kenichi Kariya
Mitsutoshi Kamada
Toru Sakaguchi
Kenichi Kariya
Mitsutoshi Kamada
Toru Sakaguchi
Application Number:
JP12871594A
Publication Date:
January 22, 2001
Filing Date:
June 10, 1994
Export Citation:
Assignee:
Shin-Kobe Electric Machinery Co., Ltd.
International Classes:
C08J5/24; B32B15/08; B32B17/04; B32B25/14; B32B25/16; B32B27/20; B32B27/38; H05K1/03; H05K3/38; (IPC1-7): B32B15/08; B32B17/04; B32B25/14; B32B25/16; B32B27/20; B32B27/38; C08J5/24; H05K1/03; H05K3/38
Domestic Patent References:
| JP4162487A | ||||
| JP56146751A |