Title:
PRODUCTION OF METAL SUPPORTING PLATE OF RESIN SEAL TYPE ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3509835
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method to easily form a dovetail groove in order for raising the bonding power of a metal supporting plate of a resin seal type semi-conductor device and a resin sealing body.
SOLUTION: A groove having a vertical wall is formed on one side main face 12 of a metal supporting plate 10 for supporting a semi-conductor element 29. A dovetail groove 15a is formed by pressing other side main face 24 of the metal supporting plate 10 with a pressing member, deforming the other side main face 24 to form a step part 27 and at the same time, deforming a pair of wall faces of the groove of one side main face 12 so as to incline. The resin sealing body 30 is installed so as to include the dovetail groove 15a.
Inventors:
Takahata, Kazumi
Yoshida, Sadao
Yoshida, Sadao
Application Number:
JP17412196A
Publication Date:
March 22, 2004
Filing Date:
June 13, 1996
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD
International Classes:
B21D31/00; B21J5/02; B21J5/06; B21K25/00; H01L23/28; (IPC1-7): B21J5/02; B21D31/00; B21J5/06; H01L23/28
Attorney, Agent or Firm:
高野 則次
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