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Title:
PRODUCTION METHOD FOR COAXIAL WIRE FOR PLUG-BOARD AND PLUG-BOARD USING THE WIRE
Document Type and Number:
Japanese Patent JPH06251642
Kind Code:
A
Abstract:

PURPOSE: To produce a coaxial wire for wiring which has sufficient adhesion between a shield layer and a resin layer when embedded in the resin layer, by forming a wire insulating layer, a copper shield layer and a coarse copper film, in order outside a core wire.

CONSTITUTION: A wire insulating layer 2 of fluoride resin such of fluorinated ethylene propylene is formed outside a core wire 1. Them, a shield layer 3 of about 5-10μ, as copper plating, of non-electrolytic copper plating or combined non-electrolytic/electrolytic copper plating, is formed outside the wire insulating layer 2. And further, a coarse copper film 4 of about 1-10μ, using copper sulfate plating solution of about 60-120g/l, is formed outside the shield wire 3. Accordingly, a coaxial wire for a plug-board, which has high adhesion between the shield wire 3. Accordingly, a coaxial wire for wiring, which has high adhesion between the shield layer 3 and the resin layer outside it, is obtained in high productivity and in good economy.


Inventors:
SHIMADA YASUSHI
IWASAKI YORIO
ARIGA SHIGEHARU
IKUI EISAKU
Application Number:
JP3717193A
Publication Date:
September 09, 1994
Filing Date:
February 26, 1993
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01B11/18; H05K3/10; H05K3/46; (IPC1-7): H01B11/18; H05K3/10; H05K3/46
Attorney, Agent or Firm:
Kunihiko Wakabayashi