PRODUCTION METHOD OF ELECTRONIC PARTS THAT ADOPTS WET ETCHING, ELECTRONIC PART AND HARD DISK SUSPENSION

Title:

PRODUCTION METHOD OF ELECTRONIC PARTS THAT ADOPTS WET ETCHING, ELECTRONIC PART AND HARD DISK SUSPENSION

Document Type and Number:

Japanese Patent JP2011254082

Kind Code:

A

Abstract:

To provide a method of producing electronic parts at low cost without using organic solvent which involves disposal problem, the method employing wet etching polyimide insulation layer of sheet laminate using dry film, the laminate having a conductive inorganic layer and an insulation layer.

The insulation layer in the laminate is wet etchable laminate structure having one or more insulating unit layers, all the layers consisting of polyimide resin. The patterning of insulating layers is conducted by a method of wet etching a laminate of dry film resist. The laminate of dry film is patterned using exposure and developing. Thereafter, the laminate of dry film undergoes one of the process selected from a group of ultraviolet irradiation treatment, heat treatment, and a combination of ultraviolet irradiation treatment and heat treatment in order to improve the dry film resist of the insulation layer in resistance to etchant.

Inventors:

SAKAYORI KATSUYA
MOMOSE TERUSUMI
TOGASHI TOMOKO
KONO SHIGEKI
AMASAKI HIROKO
UCHIYAMA TOMOAKI
YAGI YUTAKA

Application Number:

JP2011138167A

Publication Date:

December 15, 2011

Filing Date:

June 22, 2011

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD

International Classes:

H05K3/00; G03F7/004; G03F7/40; G11B5/60; G11B21/21; H05K3/06; H05K3/44

Domestic Patent References:

JP2000339650A	2000-12-08
JPH05183260A	1993-07-23
JP2000147755A	2000-05-26
JPH09166872A	1997-06-24
JP2000123512A	2000-04-28

Attorney, Agent or Firm:

Yoshihiko Mitsurai

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