Title:
PRODUCTION METHOD FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3651418
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a highly accurate production method for printed wiring board with which development is enabled by an active method while using the developer of a satisfactory working environment, resistance to electroless copper plating liquid is improved and a plating liquid is not almost contaminated.
SOLUTION: This production method for printed wiring board is provided with a process for forming a wiring pattern by electroless copper plating as a plating resist by forming a negative pattern, by forming the layers of a polyether resin compound having a carboxy group, a photopolymerizable unsaturated compound having at least one ethylene group at a terminal, and a sensitizer for generating free radicals by activating light and/or a layer of a photosensitive resin compound containing a sensitizer system.
Inventors:
Shinji Tsuchikawa
Toshiaki Ishimaru
Fumihiko Ota
Tsuyoshi Nojiri
Toshiaki Ishimaru
Fumihiko Ota
Tsuyoshi Nojiri
Application Number:
JP2001235269A
Publication Date:
May 25, 2005
Filing Date:
May 17, 1993
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/038; C08F2/44; C08F283/06; G03F7/027; G03F7/032; G03F7/40; H05K3/18; (IPC1-7): G03F7/032; G03F7/027; H05K3/18
Domestic Patent References:
| JP3191352A | ||||
| JP2166452A | ||||
| JP59149353A | ||||
| JP4109250A | ||||
| JP2269719A | ||||
| JP3106925A | ||||
| JP4109250A | ||||
| JP4195049A | ||||
| JP61177449A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu