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Title:
PRODUCTION METHOD FOR PROBE INSPECTION DEVICE
Document Type and Number:
Japanese Patent JPH0875785
Kind Code:
A
Abstract:

PURPOSE: To prevent the effects of physical impact and the like by separably adhering support material having thermally separable self-adhesive layer at least a part of the base material when the base material having a conductive projection (bump) is connected to a connection terminal of an external circuit.

CONSTITUTION: A base material 1 loading a bump forms a conduction circuit 13 on one side of insulation film 12 and a bump 11 making a continuity with the conduction circuit 13 on the other side in the constitution. A support 2 is adhered on the conduction circuit 13 so as not to disturb the connection with an external circuit C. The material of the support 2 is favorably to be polyester resin superior in mechanical strength and thermal resistivity, etc., which is adhered to the base 1 material with a weak self-adhesive. Then, an external circuit connection terminal 131 of the bump loading base material 1 is connected to the connection terminal of the external circuit C and the support 2 is separated from the base 1 to obtain the probe inspection device P.


Inventors:
YADA HIROSHI
Application Number:
JP21341494A
Publication Date:
March 22, 1996
Filing Date:
September 07, 1994
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G01R1/073; H01L21/66; G01R31/26; (IPC1-7): G01R1/073; G01R31/26; H01L21/66
Attorney, Agent or Firm:
Takashima Hajime



 
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