PURPOSE: To surely eliminate the waving, warpage, etc., of a substrate surface by heating the substrate, pressurizing the substrate by flat members from both sides, after substrate molding, and cooling the substrate while correcting the surface flat.
CONSTITUTION: The substrate 11 is heated up near to the softening point thereof by heating the same with heaters 16 from both sides in the stage of completing the magneto-optical memory element 10. The element 10 is pressurized from both sides by a pair of the flat plates 17 from both sides under heating. The waving, warpage, etc., of the substrate 11 surface are removed in this way. The substrate is slowly cooled by a cooler 181 having a circulating path 18a while the substrate is crimped by a pressure in succession. The deformations on the surface of the substrate 11 are removed by such stage, by which the mechanical characteristics are improved and the effect of improving the follow-up characteristic of a pickup, etc., is obtd.
INUI TETSUYA
SAEGUSA MICHINOBU
OTA KENJI
