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Patent Searching and Data


Title:
PRODUCTION OF PREPREG FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS62161840
Kind Code:
A
Abstract:

PURPOSE: To produce the titled prepreg having excellent drillability, peeling strength of copper foil, heat-resistance in air, etc., by impregnating a substrate with a varnish composed of an epoxy resin, a polyfunctional phenolic resin, a guanidine derivative, a coupling agent and a cure accelerator and drying the varnish.

CONSTITUTION: The objective prepreg can be produced by impregnating a substrate with a varnish produced by compounding (A) 100pts.(wt.) of an epoxy resin with (B) a polyfunctional phenolic resin of an amount corresponding to 0.5W1.5 equivalent of phenolic hydroxyl group based on the epoxy group of the component A, (C) 0.1W10pts. of a guanidine derivative of formula (R and R' are substituent group) (preferably a guanidine derivative free from cyano group), (D) 0.1W10pts. of a coupling agent and (E) 0.01W5pts. of a cure accelerator (preferably an imidazole compound having imino group masked with acrylonitrile, isocyanate, etc.) and drying the product at 80W200°C.


Inventors:
YUSA MASAMI
SHIBATA KATSUJI
MIYADERA YASUO
Application Number:
JP388686A
Publication Date:
July 17, 1987
Filing Date:
January 10, 1986
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/24; H05K1/03; (IPC1-7): C08J5/24; H05K1/03
Domestic Patent References:
JPS5874727A1983-05-06
JPS473449A
Attorney, Agent or Firm:
Hirose Akira