PURPOSE: To obtain the titled prepreg having excellent drill processability and dielectric properties, by impregnating a substrate with varnish contg. an epoxy resin, a polyfunctional phenol, a curing accelerator, a polyolefin resin and a coupling agent, and drying it.
CONSTITUTION: A substrate such as glass cloth or glass nonwoven fabric is impregnated with varnish contg. an epoxy resin (e.g. bisphenol A type epoxy resin), a polyfunctional phenol (e.g. phenolic novolak), a curing accelerator (e.g. isocyananate-masked imidazole), a polyolefin resin (e.g. PE or PP) and a coupling agent (e.g. γ-glycidoxypropyltrimethoxysilane) as essential ingredients, and then dried. The titled prepreg for a multi-layer printed wiring board which has improved drill processability, dielectric properties, resistance to peeling of copper foil and storage stability.
| JPS649214 | EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR |
| JPH05239186 | THERMOSETTING RESIN COMPOSITION |
SHIBATA KATSUJI
MIYADERA YASUO
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