Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRODUCTION OF RESIN COMPOUND FOR INTERLAYER
Document Type and Number:
Japanese Patent JPH09142894
Kind Code:
A
Abstract:

To obtain a resin compound for an interlayer in high efficiency without causing blocking and defective cutting troubles by extruding a molten strand of a resin compound for interlayer with an extruder, passing the extrudate through an aqueous dispersion of an ethylene-vinyl acetate copolymer having a specific concentration and pelletizing the cooled strand.

The objective resin compound for an interlayer is composed of 100 pts.wt. of an ethylene-vinyl acetate copolymer or an ethylene-(meth) acrylate copolymer, 5-150 pts.wt. of a hydrocarbon resin and 0.1-10 pts.wt. of a silane coupling agent. The following steps are added in the production of the resin compound. A molten strand of the resin compound extruded with an extruder is cooled by passing through an aqueous dispersion of an ethylene- vinyl acetate copolymer having a solid concentration of 1-20wt.% and the cooled strand is pelletized with a pelletizer.


Inventors:
BANDO AKIHIKO
HAYASHI SATOSHI
Application Number:
JP30474195A
Publication Date:
June 03, 1997
Filing Date:
November 22, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29B9/06; C03C27/12; C08K5/54; C08L23/08; C08L31/04; C08L89/00; C08L93/00; C08L93/04; C08L101/00; B29K23/00; (IPC1-7): C03C27/12; B29B9/06