PURPOSE: To obtain a production method in which an IC chip 4 is fixed on a substrate 1 in a moment and a wiring and sealing operation is conducted.
CONSTITUTION: A semiconductor device is produced by a method wherein a magnetic layer 2 is provided at least either the rear surface of an IC chip 4 or the top surface of a substrate 1 on which the IC chip 4 is to be mounted; an attraction layer 5 which can be magnetically attracted is provided on the other surface; the IC chip 4 is magnetically fixed on the substrate 1 by abutting the magnetic layer 2 on the attraction layer 5; and thereafter a wiring and sealing operation is conducted. Alternatively, a semiconductor device is produced by a method wherein the rear surface of the IC chip 4 is abutted on the top surface of the substrate 1 and disposed on a table provided with an electromagnet; the IC chip 4 is magnetically fixed on the substrate 1 by applying a magnetic force by the electromagnet; and thereafter a wiring and sealing operation is conducted.
ARAKI KEISUKE
SHIMOOKA YASUNORI
FUJITSU VLSI LTD