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Title:
PRODUCTION OF SINGLE SURFACE COPPER CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JPH06171017
Kind Code:
A
Abstract:

PURPOSE: To reduce the generation of warpage due to heating at the time of processing by setting the heat shrinkage factor after heating and pressing in a copper foil layer to a specific ratio with respect to that of the layer opposite to the copper foil layer in the constitution of a prepreg.

CONSTITUTION: In the production of a single surface copper clad laminated sheet, the constitution of a prepreg is set so that the heat shrinkage factor after heating and pressing of a copper foil layer is set to 25-75%, pref., 30-70% with respect to that of the layer opposite to the copper foil layer. The heat shrinkage factor is a value calculated from dimensions before and after heating when a laminate with a thickness of 1.6mm obtained by heating and pressing eight superposed prepregs of the same kind is heated to 150°C at a speed of 5°C/min and subsequently naturally cooled according to a prescribed formula.


Inventors:
SAKAI KAZUNAGA
NAKAMURA YOSHIHIRO
Application Number:
JP32820992A
Publication Date:
June 21, 1994
Filing Date:
December 08, 1992
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B37/00; B32B15/08; C08J5/24; H05K1/03; B29K105/06; (IPC1-7): B32B15/08; B29D9/00; B32B15/08; C08J5/24; H05K1/03
Attorney, Agent or Firm:
Hirose Akira