Title:
PRODUCTION OF SYNTHETIC RESIN LAMINATED LEAD PLATE
Document Type and Number:
Japanese Patent JP2628270
Kind Code:
B2
Abstract:
PURPOSE: To certainly bond a synthetic resin to the surface of lead in spite of freely bendable properties of lead without releasing the same and to improve handling properties by preventing the work-hardening of lead itself.
CONSTITUTION: At first, a lead plate P is heated to appropriate temp. and a synthetic resin film based on polyethylene partially or wholly subjected to graft modification using unsaturated carboxylic acid or a derivative thereof is arranged to the single surface or both surfaces of the heated lead plate P to be temporarily bonded thereto under pressure by a press bonding device 21. Next, this temporarily bonded laminate of the lead plate P and the synthetic resin film is heated to appropriate temp. in a heating device 31 to be fused. As a result, the compatibility of the synthetic resin film with the lead plate is improved and adhesion becomes well and the synthetic resin film can be certainly bonded to the lead plate without being released.
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Inventors:
Hideshi Kawauchi
Kuniaki Murashige
Tamura Shozo
Kuniaki Murashige
Tamura Shozo
Application Number:
JP12853293A
Publication Date:
July 09, 1997
Filing Date:
April 30, 1993
Export Citation:
Assignee:
Mitsui Petrochemical Industry Co., Ltd.
Nitto Kakoki Co., Ltd.
Nitto Kakoki Co., Ltd.
International Classes:
B29C65/02; B32B15/08; B32B37/10; B29C65/44; B29K23/00; (IPC1-7): B29C65/02; B32B15/08; B32B31/20
Domestic Patent References:
| JP62179922A | ||||
| JP2501641A | ||||
| JP57191054A |
Attorney, Agent or Firm:
Nakamura Masami
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