PURPOSE: To form a thin film having large area and reduced in film thickness distribution by carrying out vapor deposition while changing the part where a thin film is deposited by displacing a substrate in a laser vapor deposition method.
CONSTITUTION: The inside of a chamber 1 is evacuated and an oxygen- containing gas is supplied via a nozzle 6, and then, a target 5 on a turntable 11 turning by means of a motor 14 is irradiated with pulse laser light generated in a laser device 10 via a condensing lens 9 and an entrance window 7. At this time, a control device 13 is constituted so that the end of a plume generated when the target 5 is irradiated with the pulse laser light is brought into contact with the different part of the substrate 2 with every pulse by sending a control signal to an XY stage 12 and displacing the substrate 2 on a substrate holder 3 with every pulse. By this method, the thin film having a large area and reduced in film thickness and film quality distributions can be formed on the substrate 2.
OTA YUKIHIRO
FUJIMORI NAOHARU
