To provide a program for calculating the concentration of impurity within a plating layer, which may calculate the concentration of the impurity within the plating layer and generate a highly-reliable report for the plating.
The program for calculating the concentration of impurity within the plating layer, comprising the steps of: selecting a required form from a plurality of formes, each part of which are predetermined for plating; selecting a predetermined size data in accordance with each form; calculating a surface area for a component comprising a combination of forms selected by using the predetermined data; calculating also the concentration of the impurity within the plating layer being coated on the component by using the surface area derived by a step of calculating the surface area for the component and each parameter for the component; acquiring each type of parameters to calculate the surface area and the concentration of the impurity; and executing a step of generating a data for printing on a computer without permitting to edit calculated results.
JP2007010526A | 2007-01-18 | |||
JP2006317351A | 2006-11-24 |
Next Patent: VENDING MACHINE, VENDING METHOD THEREOF, AND VENDING PROGRAM THEREOF