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Title:
PROGRAM FOR CALCULATING CONCENTRATION OF IMPURITY WITHIN PLATING LAYER
Document Type and Number:
Japanese Patent JP2007172367
Kind Code:
A
Abstract:

To provide a program for calculating the concentration of impurity within a plating layer, which may calculate the concentration of the impurity within the plating layer and generate a highly-reliable report for the plating.

The program for calculating the concentration of impurity within the plating layer, comprising the steps of: selecting a required form from a plurality of formes, each part of which are predetermined for plating; selecting a predetermined size data in accordance with each form; calculating a surface area for a component comprising a combination of forms selected by using the predetermined data; calculating also the concentration of the impurity within the plating layer being coated on the component by using the surface area derived by a step of calculating the surface area for the component and each parameter for the component; acquiring each type of parameters to calculate the surface area and the concentration of the impurity; and executing a step of generating a data for printing on a computer without permitting to edit calculated results.


Inventors:
YAGISAWA MASASHI
Application Number:
JP2005370382A
Publication Date:
July 05, 2007
Filing Date:
December 22, 2005
Export Citation:
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Assignee:
NITTO SEIKO KK
International Classes:
G06F17/50; C25D21/00
Domestic Patent References:
JP2007010526A2007-01-18
JP2006317351A2006-11-24