Title:
PROJECTED LINE RESIN FILM FORMING METHOD AND RECORDING MEDIUM
Document Type and Number:
Japanese Patent JP3692051
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form a projected line resin film consisting of resin.
SOLUTION: A first recessed part 17a and a second recessed part 17b are formed in a flat substrate 11 at a prescribed interval and resin liquid is supplied on a flat part of the surface of the substrate 11 exposed between the first and the second recessed parts 17a and 17b. The resin liquid supplied rises by its surface tension and by curing the resin liquid in this state, the projected line resin film 20 having uniform width is formed. A projecting parts 18a and 18b are formed at edge parts of respective openings of the first and the second recessed parts 17a and 17b and liquid sagging and protrusion of the resin liquid are not generated, since the resin liquid is supplied between the projecting parts 18a and 18b.
Inventors:
Mieko Tanaka
Misao Konishi
Satoshi Yanagita
Misao Konishi
Satoshi Yanagita
Application Number:
JP2001127173A
Publication Date:
September 07, 2005
Filing Date:
April 25, 2001
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
B29C35/08; B29C39/10; B29C39/22; B29C41/22; B29C59/02; B29D17/00; G11B7/26; B29C59/16; B29K101/00; B29L9/00; B29L11/00; (IPC1-7): G11B7/26; B29C35/08; B29C39/10; B29C39/22
Domestic Patent References:
| JP2001067730A | ||||
| JP10106044A | ||||
| JP2000293902A | ||||
| JP2001023238A | ||||
| JP9115189A |
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe
Hideki Abe