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Patent Searching and Data


Title:
PROJECTING EXPOSURE METHOD
Document Type and Number:
Japanese Patent JP3412704
Kind Code:
B2
Abstract:

PURPOSE: To accurately make a reticle coordinate system correspond to a wafer coordinate system by reducing influence of a lithographic error of a reticle when it is exposed by a slit scanning system.
CONSTITUTION: Two rows of alignment mark images 29AW-29DW and 30AW-30DW are projected on a projected image 12W of a reticle in a scanning direction, and two rows of reference marks 35A-35D and 36A-36D are formed as well on a reference mark plate 6 of the wafer stage side in the scanning direction. The reticle and the plate 6 are moved in the scanning direction, an error of the images 29AW, 30AW and the marks 35A, 36A is obtained by a reticle alignment microscope, an error of the other image and the reference mark is similarly obtained, these errors are corrected by a measuring error of a coordinate measuring system, thereby obtaining a conversion parameter between a reticle coordinate system and a wafer coordinate system.


Inventors:
Kenji Nishi
Application Number:
JP33475993A
Publication Date:
June 03, 2003
Filing Date:
December 28, 1993
Export Citation:
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Assignee:
NIKON CORPORATION
International Classes:
G03F7/207; G03F7/20; G03F9/00; H01L21/027; (IPC1-7): H01L21/027; G03F7/20; G03F9/00
Domestic Patent References:
JP4196513A
JP521314A
JP6284516A
JP4277612A
JP2272719A
JP63128713A
Attorney, Agent or Firm:
Satoshi Ohmori