Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROPYLENE-BASED POLYMER, PROPYLENE-BASED RESIN COMPOSITION, AND HOT-MELT ADHESIVE CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP2018076454
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot-melt adhesive which has an improved adhesive strength while maintaining or improving fluidity.SOLUTION: There are provided: [1] a propylene-based polymer having a melting endotherm (ΔH-D) measured by a differential scanning calorimeter (DSC) of 0-80 J/g and a viscosity measured by a B-type viscometer at 190°C of 500-6,000 mPa s; [2] a propylene-based resin composition containing a resin (A) containing the propylene-based polymer, and a plasticizer (B); and [3] a hot-melt adhesive containing the propylene-based polymer or the propylene-based resin composition.SELECTED DRAWING: None

More Like This:
JP2744317INDUSTRIAL APPLICABILITY A method for producing a propylene polymer having a free-end long-chain branch and its use.
JP4383549Olefin polymerization catalyst and its method
JP2001335605CATALYST FOR PROPYLENE POLYMERIZATION AND METHOD FOR PRODUCING POLYPROPYLENE USING THE SAME
Inventors:
FUJII NOZOMI
KANAMARU MASAMI
Application Number:
JP2016219889A
Publication Date:
May 17, 2018
Filing Date:
November 10, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IDEMITSU KOSAN CO
International Classes:
C08F10/06; C08L23/10; C08L91/00; C08L101/00; C09J11/06; C09J123/04; C09J123/10; C09J131/04; C09J153/00
Domestic Patent References:
JP2016117888A2016-06-30
JP2015509554A2015-03-30
JP2014034159A2014-02-24
JP2014159563A2014-09-04
Foreign References:
WO2014069606A12014-05-08
WO2014077258A12014-05-22
US20160177141A12016-06-23
CN104893658A2015-09-09
WO2016004239A12016-01-07
Attorney, Agent or Firm:
Tamotsu Otani
Wataru Sasaki



 
Previous Patent: An insulating resin composition for metal base plate circuit boards and a manufacturing method for t...

Next Patent: A constituent for optical solid modeling