Title:
保護膜形成用フィルム及び保護膜形成用複合シート
Document Type and Number:
Japanese Patent JP7326100
Kind Code:
B2
Abstract:
The present invention provides a film for forming a protective film for forming a protective film on the back surface of a chip, in which utilizing the maximum value (X_max) of absorbance of the protective film at a wavelength of 1400-1500 nm and the specific heat (S_150) of the protective film at 150℃, Z_150 calculated by the formula Z_150 = X_max/S_150 is 0.38 or more, and utilizing the X_max and the specific heat (S_200) of the protective film at 200℃, Z_200 calculated by the formula Z_200 = X_max/S_200 is 0.33 or more. Also provided is a composite sheet for forming a protective film, which is provided with a support sheet and the film for forming a protective film provided on one surface of the support sheet.
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Inventors:
Yuichiro Komasu
Hiroyuki Yoneyama
Hiroyuki Yoneyama
Application Number:
JP2019184718A
Publication Date:
August 15, 2023
Filing Date:
October 07, 2019
Export Citation:
Assignee:
Lintec Corporation
International Classes:
H01L21/301; C09J7/10; C09J7/24; C09J7/25; C09J7/35; C09J11/04; C09J11/06; C09J201/00
Domestic Patent References:
| JP2013194102A | ||||
| JP2015032644A | ||||
| JP2019059879A | ||||
| JP2018127571A |
Foreign References:
| WO2019131850A1 |
Attorney, Agent or Firm:
Kazuzumi Nishizawa
Mitsunaga Igarashi
Hiroyuki Kato
Mitsunaga Igarashi
Hiroyuki Kato