Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
打ち抜きステージ
Document Type and Number:
Japanese Patent JP3983756
Kind Code:
B2
Abstract:
The stamping station (1) receives a web of e.g. plastics packaging foil (4) with preformed pockets (8). This moves past a control circuit (7) to a suction holder (9) which holds the foil over a stamping tool (5). This separates the individual pockets from the foil. The pockets are used for packaging objects by thermoforming. Fault-free pockets (2) are picked up by a conveyer (6). A detector (10) senses faults in packages and faulty pockets (3) remain attached to the foil and are diverted from the conveyer into a knife mechanism (13,14) with a second sensor or detector (15) which cuts them up.

Inventors:
Detlef Gertichke
Wolfgang Rodi
Application Number:
JP2004316404A
Publication Date:
September 26, 2007
Filing Date:
October 29, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Uhlmann Pac-Systeme GmbH & Co. KG
International Classes:
B65B57/00; B26D5/00; B26D5/26; B26F1/40; B65B57/02; B65B57/04; B65B57/10; B65B61/06; B65B61/08; B26D7/18
Domestic Patent References:
JP8198216A
JP5278731A
JP11165293A
JP11073508A
JP62146110A
JP61214911A
JP60099832A
JP53029892A
JP2003072722A
JP2002104337A
JP2003094031A
JP2001354201A
JP55041971B1
Attorney, Agent or Firm:
Tamako Tsutada
Masato Tsuda
Tetsuji Nakamura
Katsuyuki Tomita
Husband



 
Previous Patent: ノックセンサ

Next Patent: 竪樋支持具