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Patent Searching and Data


Title:
PUNCTURE SEALANT
Document Type and Number:
Japanese Patent JP2010037521
Kind Code:
A
Abstract:

To provide a puncture sealant which forms a coagulant difficult to come off from a punctured hole.

The puncture sealant includes at least one kind of adhesives selected from the group consisting of natural resin, modified rosin resin, terpene-modified resin, aliphatic hydrocarbon resin, cyclopentadiene resin, alkylphenol-acetylene resin, styrenic resin, xylene resin, coumarone-indene resin, and vinyltoluene--methylstyrene copolymer, and latex. Preferably, the mass of the adhesive is not less than 55 mass% and not more than 200 mass% to the total mass of the solid of the latex. Preferably, when the puncture sealant is coagulated, the coagulum has tensile strength of not less than 0.05 MPa and not more than 10 MPa and hardness of not less than 20 degree and not more than 150 degree.


Inventors:
MINOJIMA HARUKI
EGUCHI SHINICHI
HIRATA NARUKUNI
Application Number:
JP2008205536A
Publication Date:
February 18, 2010
Filing Date:
August 08, 2008
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
C09K3/10; B29C73/16
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda