Title:
RFIC及びアンテナシステムを有するRFシステム
Document Type and Number:
Japanese Patent JP6695380
Kind Code:
B2
Abstract:
In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
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Inventors:
Trotta, Saverio
Bachety, Astosh
Baru, Jagith Shin
Jungmeier, Reinhard-Wolfgang
Nasr, Ismail
Noppenay, Dennis
Bachety, Astosh
Baru, Jagith Shin
Jungmeier, Reinhard-Wolfgang
Nasr, Ismail
Noppenay, Dennis
Application Number:
JP2018088518A
Publication Date:
May 20, 2020
Filing Date:
May 02, 2018
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG
International Classes:
G01S7/03; G01S7/02; G01S13/34; G01S13/931; H01Q13/08; H01Q19/30; H01Q21/06; H01Q23/00
Domestic Patent References:
JP2014020998A | ||||
JP2013195237A | ||||
JP2014135641A | ||||
JP2003121538A | ||||
JP2012159348A | ||||
JP2003172776A | ||||
JP2005315898A | ||||
JP2016166859A |
Foreign References:
US20160204784 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation